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To meet different needs, provide a complete service system to help enterprises achieve the transformation and upgrading of intelligent manufacturing
200+ products to empower new momentum in the intelligent industry
Fully develop industry value with our rich experience, and assist enterprises in completing digital transformation and upgrading
Aggregating ecological capabilities to achieve new changes in intelligent manufacturing
Creating a sharing-based, interconnected industrial platform with the most long-term value
Provincial key industrial Internet platform
A one-stop digital solution platform for production units based on SasS and intelligent hardware integration
We focus on the AI+IoT platform in the industrial field, and provide time-saving and efficient professional services for the upgrading of industrial Internet and industrial Internet of Things
We focus on the whole industrial value chain scenario, enabling efficient implementation of AI No Code application development platform
The blue ocean of the intelligent manufacturing market is waiting for you. AUO Digitech is looking forward to winning together with you!
Learn the latest news and media reports of AUO Digitech
In recent years, the semiconductor assembly and packaging industry, which has been known for its labor-intensive nature, has been facing talent shortages due to the issue of declining birth rates. To address the labor shortage challenge faced by semiconductor assembly and packaging field, AUO Digitech, a subsidiary of AUO specializing in providing smart industrial services, has independently developed the Intelligent Automated Material Handling System (iAMHS). By combining the world-leading ball bonder from Kulicke & Soffa Industries, Inc. (K&S) and the rail guided vehicle (RGV) system from Leyu Precision Co., Ltd. (Leyu), AUO Digitech has created a comprehensive solution that has been successfully implemented at multiple semiconductor production sites. This solution not only helps client achieve full automation of their production lines, but also increases production capacity by at least 10%.
In recent years, the semiconductor assembly and packaging industry, which has been known for its labor-intensive nature, has been facing talent shortages due to the issue of declining birth rates. To address the labor shortage challenge faced by semiconductor assembly and packaging field, AUO Digitech, a subsidiary of AUO specializing in providing smart industrial services, has independently developed the Intelligent Automated Material Handling System (iAMHS). By combining the world-leading ball bonder from Kulicke & Soffa Industries, Inc. (K&S) and the rail guided vehicle (RGV) system from Leyu Precision Co., Ltd. (Leyu), AUO Digitech has created a comprehensive solution that has been successfully implemented at multiple semiconductor production sites. This solution not only helps client achieve full automation of their production lines, but also increases production capacity by at least 10%.